毫米波键合线互连性能分析

2010 IEEE Electrical Design of Advanced Package & Systems Symposium Pub Date : 2010-12-01 DOI:10.1109/EDAPS.2010.5683034

Jiankang Li, Y. Xiong, Sanming Hu, W. Goh, Debin Hou, Wen Wu

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引用次数: 14

摘要

本文全面分析了170 GHz频率下的键合线互连的电气性能。分析了导线长度、回路高度、焊盘面积等因素的影响。讨论了焊线的电学模型。通过减小连接距离和优化焊盘面积，可以提高焊线的性能。得到了最高达170 GHz的焊线可接受的测量结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Performance analyse on millimetre-wave bonding-wire interconnection

This paper presents a comprehensive analysis of the electrical performance of the bonding-wire interconnection up to 170 GHz. The effects of the wire length, loop height and pad area have all been analyzed. An electrical model for the bonding-wire is discussed. By reducing interconnection distance and optimizing pad area, the performance of the bonding-wire can be enhanced. The acceptable measurement results of the bonding-wire up to 170 GHz are obtained.

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来源期刊

2010 IEEE Electrical Design of Advanced Package & Systems Symposium

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