Jiankang Li, Y. Xiong, Sanming Hu, W. Goh, Debin Hou, Wen Wu
{"title":"毫米波键合线互连性能分析","authors":"Jiankang Li, Y. Xiong, Sanming Hu, W. Goh, Debin Hou, Wen Wu","doi":"10.1109/EDAPS.2010.5683034","DOIUrl":null,"url":null,"abstract":"This paper presents a comprehensive analysis of the electrical performance of the bonding-wire interconnection up to 170 GHz. The effects of the wire length, loop height and pad area have all been analyzed. An electrical model for the bonding-wire is discussed. By reducing interconnection distance and optimizing pad area, the performance of the bonding-wire can be enhanced. The acceptable measurement results of the bonding-wire up to 170 GHz are obtained.","PeriodicalId":185326,"journal":{"name":"2010 IEEE Electrical Design of Advanced Package & Systems Symposium","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"Performance analyse on millimetre-wave bonding-wire interconnection\",\"authors\":\"Jiankang Li, Y. Xiong, Sanming Hu, W. Goh, Debin Hou, Wen Wu\",\"doi\":\"10.1109/EDAPS.2010.5683034\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a comprehensive analysis of the electrical performance of the bonding-wire interconnection up to 170 GHz. The effects of the wire length, loop height and pad area have all been analyzed. An electrical model for the bonding-wire is discussed. By reducing interconnection distance and optimizing pad area, the performance of the bonding-wire can be enhanced. The acceptable measurement results of the bonding-wire up to 170 GHz are obtained.\",\"PeriodicalId\":185326,\"journal\":{\"name\":\"2010 IEEE Electrical Design of Advanced Package & Systems Symposium\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE Electrical Design of Advanced Package & Systems Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2010.5683034\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE Electrical Design of Advanced Package & Systems Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2010.5683034","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Performance analyse on millimetre-wave bonding-wire interconnection
This paper presents a comprehensive analysis of the electrical performance of the bonding-wire interconnection up to 170 GHz. The effects of the wire length, loop height and pad area have all been analyzed. An electrical model for the bonding-wire is discussed. By reducing interconnection distance and optimizing pad area, the performance of the bonding-wire can be enhanced. The acceptable measurement results of the bonding-wire up to 170 GHz are obtained.