介电材料对高速数字应用ATE测试夹具的影响

J. Moreira, H. Barnes, W. Burns, D. Sionne, C. Gutierrez, F. Azeem
{"title":"介电材料对高速数字应用ATE测试夹具的影响","authors":"J. Moreira, H. Barnes, W. Burns, D. Sionne, C. Gutierrez, F. Azeem","doi":"10.1109/MSMW.2007.4294821","DOIUrl":null,"url":null,"abstract":"There are ever increasing challenges when developing test fixtures for high-speed applications using automated test equipment (ATE). This is due to the many variables and considerations that must go into developing characterization test fixtures for I/O cells in the 5 to 10 Gbps range. The purpose of these fixtures is to provide the best possible signal integrity of multi-gigabit data signals between the ATE and the device under test (DUT). One of the variables and considerations that needs to be controlled is the correct choice of dielectric material. Although there is a significant amount of work on dielectric loss for microwave applications, high-speed digital applications have different requirements given the broad frequency bandwidth of digital data patterns, as well as the high density of the I/O interconnects. Modern integrated circuits might have hundreds of differential high speed I/O cells requiring complex multilayer printed circuit boards (PCB) composed of different dielectric materials to be utilized for the test fixtures.","PeriodicalId":235293,"journal":{"name":"2007 International Kharkov Symposium Physics and Engrg. of Millimeter and Sub-Millimeter Waves (MSMW)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Influence of Dielectric Materials on ATE Test Fixtures for High-Speed Digital Applications\",\"authors\":\"J. Moreira, H. Barnes, W. Burns, D. Sionne, C. Gutierrez, F. Azeem\",\"doi\":\"10.1109/MSMW.2007.4294821\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"There are ever increasing challenges when developing test fixtures for high-speed applications using automated test equipment (ATE). This is due to the many variables and considerations that must go into developing characterization test fixtures for I/O cells in the 5 to 10 Gbps range. The purpose of these fixtures is to provide the best possible signal integrity of multi-gigabit data signals between the ATE and the device under test (DUT). One of the variables and considerations that needs to be controlled is the correct choice of dielectric material. Although there is a significant amount of work on dielectric loss for microwave applications, high-speed digital applications have different requirements given the broad frequency bandwidth of digital data patterns, as well as the high density of the I/O interconnects. Modern integrated circuits might have hundreds of differential high speed I/O cells requiring complex multilayer printed circuit boards (PCB) composed of different dielectric materials to be utilized for the test fixtures.\",\"PeriodicalId\":235293,\"journal\":{\"name\":\"2007 International Kharkov Symposium Physics and Engrg. of Millimeter and Sub-Millimeter Waves (MSMW)\",\"volume\":\"44 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-06-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 International Kharkov Symposium Physics and Engrg. of Millimeter and Sub-Millimeter Waves (MSMW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MSMW.2007.4294821\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 International Kharkov Symposium Physics and Engrg. of Millimeter and Sub-Millimeter Waves (MSMW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MSMW.2007.4294821","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

在使用自动测试设备(ATE)开发高速应用的测试夹具时,面临着越来越多的挑战。这是由于在为5到10 Gbps范围内的I/O单元开发表征测试装置时必须考虑许多变量和因素。这些装置的目的是在ATE和被测设备(DUT)之间提供最好的多千兆数据信号完整性。需要控制的变量和考虑因素之一是电介质材料的正确选择。尽管对微波应用的介电损耗进行了大量的研究,但鉴于数字数据模式的宽频率带宽以及I/O互连的高密度,高速数字应用具有不同的要求。现代集成电路可能有数百个差分高速I/O单元,需要由不同介电材料组成的复杂多层印刷电路板(PCB)用于测试夹具。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of Dielectric Materials on ATE Test Fixtures for High-Speed Digital Applications
There are ever increasing challenges when developing test fixtures for high-speed applications using automated test equipment (ATE). This is due to the many variables and considerations that must go into developing characterization test fixtures for I/O cells in the 5 to 10 Gbps range. The purpose of these fixtures is to provide the best possible signal integrity of multi-gigabit data signals between the ATE and the device under test (DUT). One of the variables and considerations that needs to be controlled is the correct choice of dielectric material. Although there is a significant amount of work on dielectric loss for microwave applications, high-speed digital applications have different requirements given the broad frequency bandwidth of digital data patterns, as well as the high density of the I/O interconnects. Modern integrated circuits might have hundreds of differential high speed I/O cells requiring complex multilayer printed circuit boards (PCB) composed of different dielectric materials to be utilized for the test fixtures.
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