Brightfield iADC在产量学习和偏移监测中的应用

The 17th Annual SEMI/IEEE ASMC 2006 Conference Pub Date : 2006-05-22 DOI:10.1109/ASMC.2006.1638752

J. Wittenzellner

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引用次数: 5

摘要

内联ADC在运行时为所有检测到的晶圆缺陷提供分类数据，而不会对工具吞吐量产生负面影响。MTV已经成功地使用iADC来监测偏差，并通过内联检测来预测探头故障。iADC的使用减少了MTV对SEM审查的依赖，并允许在生产车间更一致地处理过程问题。虽然iADC不是一个独立的良率改进解决方案，但它确实为缺陷工程师提供了另一个强大的工具

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Brightfield iADC Applications for Yield Learning and Excursion Monitoring

Inline ADC provides classification data for all detected wafer defects at run time, without having a negative impact on tool throughput. MTV has successfully used iADC to monitor excursions as well as predict probe fails using inline inspections. The use of iADC has reduced MTV's reliance on SEM review and allowed for more consistent disposition of process issues on the production floor. While iADC is not a standalone solution to yield improvement, it does provide another powerful tool for the defect engineer

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The 17th Annual SEMI/IEEE ASMC 2006 Conference

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