微机械谐振器中能量损失机制的研究

R. Candler, H. Li, M. Lutz, W. Park, A. Partridge, G. Yama, T. Kenny
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引用次数: 62

摘要

建立了谐振频率为500 kHz至10 MHz的微机械谐振器,并对几种能量损失机制进行了研究。考虑了热弹性阻尼、夹紧损耗和空气阻尼。这些装置被证明受到热弹性阻尼的限制,在微观尺度上提供了这种现象的实验验证。具有缩放尺寸的谐振器也符合给定压力下阻尼的缩放理论。对于长宽比小于10:1的谐振腔,热弹性耗散以外的能量损失机制(最有可能是箝位损耗)占主导地位。该器件采用单晶圆封装工艺制造。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of energy loss mechanisms in micromechanical resonators
Micromechanical resonators with resonant frequencies from 500 kHz to 10 MHz were built and examined for several energy loss mechanisms. Thermoelastic damping, clamping loss and air damping were considered. The devices were shown to be limited by thermoelastic damping, providing experimental verification of this phenomenon at the microscale. Resonators with scaled dimensions also matched well with scaling theory of damping at a given pressure. An energy loss mechanism other than thermoelastic dissipation, most likely clamping loss, was shown to be dominant for resonators whose ratio of length to width was less than 10:1. The devices were fabricated using a single-wafer encapsulation process.
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