{"title":"减少光刻中静电相关缺陷","authors":"A. Steinman","doi":"10.1109/ISSM.1994.729449","DOIUrl":null,"url":null,"abstract":"Failure to control static charge creates problems in a variety of cleanroom environments. This is particularly apparent in photolithography areas where both the product wafers and the reticles are at risk to the effects of static charge. This paper presents an introduction to static charge control in photolithography areas and the use of air ionization for this purpose.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Reducing Electrostatic Related Defects In Photolithography\",\"authors\":\"A. Steinman\",\"doi\":\"10.1109/ISSM.1994.729449\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Failure to control static charge creates problems in a variety of cleanroom environments. This is particularly apparent in photolithography areas where both the product wafers and the reticles are at risk to the effects of static charge. This paper presents an introduction to static charge control in photolithography areas and the use of air ionization for this purpose.\",\"PeriodicalId\":114928,\"journal\":{\"name\":\"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-06-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM.1994.729449\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.1994.729449","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reducing Electrostatic Related Defects In Photolithography
Failure to control static charge creates problems in a variety of cleanroom environments. This is particularly apparent in photolithography areas where both the product wafers and the reticles are at risk to the effects of static charge. This paper presents an introduction to static charge control in photolithography areas and the use of air ionization for this purpose.