IMA中电路板电磁兼容验证的近场测量

C. Marot, A. Jaber
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引用次数: 0

摘要

目前,飞机上的电子嵌入式架构是基于传统的方法,在独立的飞机系统上使用称为LRU(线路可替换单元)的模块。需要降低成本和重量的嵌入式电子单元通过实现更模块化的电子架构AC与基本模块。目前还没有对电子模块级别的电磁兼容航空电子测试进行定义。这些研究的目的是为已定义的EMC测试设置和模块级别的相关限制提供技术数据,以满足环境要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Near field measurement for EMC validation of electronics board in IMA
Today the electronic embedded architecture in aircraft is based on traditional approaches on the independent aircraft systems with modules called LRU, Line Replaceable Unit. Needs to reduce cost and weight of the embedded electronic units pass by the implementation of a more modular electronics in the architectures AC with elementary module. Such EMC avionic tests description at electronics modules levels are not defined today. The objectives of those studies are to give technical data to defined EMC test setup and associated limits at modules levels to respect environment requirements.
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