S. C. Chen, C. L. Chen, Y. Lee, S. W. Chang, J. Shih, Y. Lee, D. Maji, K. Wu
{"title":"一种可靠的高级栅极堆TDDB寿命投影模型","authors":"S. C. Chen, C. L. Chen, Y. Lee, S. W. Chang, J. Shih, Y. Lee, D. Maji, K. Wu","doi":"10.1109/IIRW.2013.6804169","DOIUrl":null,"url":null,"abstract":"In this paper, a reliable TDDB lifetime projection by modeling the gate leakage current degradation is proposed. The validity of model is demonstrated by the good agreements with the experimental results. The two-stage Ig degradation and voltage-dependent Weibull slope are explained through the associated trap generation during the TDDB stress. Based on this model., accurate TDDB lifetime prediction can be achieved for HK/IL gate stack.","PeriodicalId":287904,"journal":{"name":"2013 IEEE International Integrated Reliability Workshop Final Report","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"A reliable TDDB lifetime Projection model for advanced gate stack\",\"authors\":\"S. C. Chen, C. L. Chen, Y. Lee, S. W. Chang, J. Shih, Y. Lee, D. Maji, K. Wu\",\"doi\":\"10.1109/IIRW.2013.6804169\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a reliable TDDB lifetime projection by modeling the gate leakage current degradation is proposed. The validity of model is demonstrated by the good agreements with the experimental results. The two-stage Ig degradation and voltage-dependent Weibull slope are explained through the associated trap generation during the TDDB stress. Based on this model., accurate TDDB lifetime prediction can be achieved for HK/IL gate stack.\",\"PeriodicalId\":287904,\"journal\":{\"name\":\"2013 IEEE International Integrated Reliability Workshop Final Report\",\"volume\":\"6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE International Integrated Reliability Workshop Final Report\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IIRW.2013.6804169\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Integrated Reliability Workshop Final Report","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIRW.2013.6804169","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A reliable TDDB lifetime Projection model for advanced gate stack
In this paper, a reliable TDDB lifetime projection by modeling the gate leakage current degradation is proposed. The validity of model is demonstrated by the good agreements with the experimental results. The two-stage Ig degradation and voltage-dependent Weibull slope are explained through the associated trap generation during the TDDB stress. Based on this model., accurate TDDB lifetime prediction can be achieved for HK/IL gate stack.