功率器件焊线用金带电流与温度效应的实验研究

2014 IEEE 2nd International Conference on Emerging Electronics (ICEE) Pub Date : 2014-12-01 DOI:10.1109/ICEMELEC.2014.7151206

Shreesha Prabhu, Sankaran Koyili, M. Manjunath, M. Nayak

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引用次数: 0

摘要

线键合是一种众所周知的方法，用于互连集成电路(IC)芯片及其封装的引线。本文介绍了电流对功率器件封装中用于焊线的金(Au)带温度的影响。采用红外光谱仪研究和直接薄膜Pt温度传感器分析方法对金带中的温度变化进行了分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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An experimental study on current vs. temperature effect of gold ribbon for wire bonding in power devices

Wire Bonding is a well known method used for interconnecting integrated circuit (IC) die and the leads of its package. In this paper, the effect of current on the temperature of the gold (Au) ribbon used for wire bonding in the packaging of power device is presented. Infrared spectrometer study and direct thin film Pt temperature sensor analysis were used to analyze the temperature variations in gold ribbon.

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2014 IEEE 2nd International Conference on Emerging Electronics (ICEE)

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