{"title":"电子系统传热的间接研究","authors":"M. Frivaldský, P. Spánik, P. Drgona, J. Koscelnik","doi":"10.1109/AE.2014.7011676","DOIUrl":null,"url":null,"abstract":"This paper deals with the development of methodology suited for design of computation algorithm which is able to determine power losses of electronic systems based on measured temperature distribution. Second part of paper is given to development of methodology for optimal selection of mentioned active components for thermal simulation model of given electronic system. Finally experimental verification of proposed methodology is presented.","PeriodicalId":149779,"journal":{"name":"2014 International Conference on Applied Electronics","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2014-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Indirect investigation of heat transfer of electronic system\",\"authors\":\"M. Frivaldský, P. Spánik, P. Drgona, J. Koscelnik\",\"doi\":\"10.1109/AE.2014.7011676\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper deals with the development of methodology suited for design of computation algorithm which is able to determine power losses of electronic systems based on measured temperature distribution. Second part of paper is given to development of methodology for optimal selection of mentioned active components for thermal simulation model of given electronic system. Finally experimental verification of proposed methodology is presented.\",\"PeriodicalId\":149779,\"journal\":{\"name\":\"2014 International Conference on Applied Electronics\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 International Conference on Applied Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/AE.2014.7011676\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 International Conference on Applied Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AE.2014.7011676","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Indirect investigation of heat transfer of electronic system
This paper deals with the development of methodology suited for design of computation algorithm which is able to determine power losses of electronic systems based on measured temperature distribution. Second part of paper is given to development of methodology for optimal selection of mentioned active components for thermal simulation model of given electronic system. Finally experimental verification of proposed methodology is presented.