使用微配置热电和流体系统的集成电路和光电子器件的主动冷却

E. Yu, Deming Wang, Sura Kim, A. Przekwas
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引用次数: 3

摘要

本文介绍了一种新型热电流集成冷却器(TEFC)。该装置主要由一个低维热电热泵和一个高度集成的微型流体回路组成。热电器件热侧微通道中的微翅片结构增强了散热性能。讨论的重点是TEFC的概念设计和热电和流体电路的数值模型。给出了制冷回路建模的仿真结果。此外,对不同的衬底材料进行了评估,以改善散热。与铜块相比,金刚石和铜块中的微通道都能有效地去除热量,并在活性表面上保持更均匀的温度分布。并对微通道中翅片的配置进行了评价。初步结果表明,TEFC装置在冷却通信和移动电子系统中具有很大的应用潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Active cooling of integrated circuits and optoelectronic devices using a micro configured thermoelectric and fluidic system
In this paper we present a new integrated thermo-electric-fluidic cooler (TEFC). This device is essentially composed of a low dimensional thermoelectric heat pump and a miniature fluidic loop in a highly integrated architecture. Heat removal is enhanced by micro-fin structures in the microchannels on the hot side of the thermoelectric device. Discussions are focused on the conceptual design of the TEFC and numerical models for the thermoelectric, and fluidic circuits. Simulation results on modeling of refrigeration loop are presented. Also different substrate materials are evaluated for improved heat spreading. Microchannels in both diamond and copper blocks are found to effectively remove heat and keep a more uniform temperature profile on the active surfaces than in CuW blocks. Fin configurations in the microchannels for enhancing liquid cooling are also evaluated. Preliminary results obtained for a TEFC device show great potentials for applications in cooling communication and mobile electronic systems.
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