基于芯片系统的感应耦合无线总线

2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC) Pub Date : 2020-01-01 DOI:10.1109/ASP-DAC47756.2020.9045184

J. Kadomoto, Satoshi Mitsuno, H. Irie, S. Sakai

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引用次数: 2

摘要

提出了一种用于芯片间通信的无线总线。利用片上线圈的水平电感耦合，建立了芯片之间的无线连接。以0.18美元/ μ m美元CMOS为原型的测试芯片证实了水平排列线圈之间的2.0 Gb/s总线通信，误码率小于10^{-12}美元。

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An Inductively Coupled Wireless Bus for Chiplet-Based Systems

A wireless bus for inter-chiplet communication is presented. Utilizing horizontal inductive coupling of on-chip coils, wireless connection between chiplets are established. A test chip prototyped in 0.18 $\mu m$ CMOS confirms 2.0 Gb/s bus communication between horizontally arranged coils with BER of less than $10^{-12}$.

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来源期刊

2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC)

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