探测SRAM信号的产量管理

Gregory M. Johnson, A. Rummel, M. Kemmler, T. Lundquist, Baohua Nui
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引用次数: 2

摘要

探测越来越多地用于表征集成电路的局部电学特性,以及缺陷隔离。采用电子束感应电流(EBIC)、单探针和双探针电子束吸收电流(EBAC)和电子束感应电阻变化(EBIRCH)等多种探测模式对测试结构和/或SRAM阵列进行了检测。结果证明了在SRAM成品率管理中使用每种方法的价值。EBIC提供了p井和n井之间衰竭带的成像,即使在平面视图中也是如此。EBAC可以提供基本连通性的信息,也可以实现沿导体电阻区的隔离。EBIRCH由两种不同的机制(电阻率热系数和塞贝克效应)驱动,可以根据不同的条件提供两种不同的分析类型。EBIRCH不仅精确地隔离了负责短路的鳍,而且还突出了SRAM中下拉器件元件之间的热关系。这些技术一起提供了多种形式的过程反馈在一个集成的良率管理程序中,包括通孔链、SRAM并行阵列测试结构和SRAM的分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Probing SRAM Signals for Yield Management
Probing is increasingly utilized for characterization of local electrical properties of ICs, as well as for defect isolation. Test structures and/or SRAM arrays were examined with various probing modes, i.e. Electron Beam Induced Current (EBIC), both one and two probe Electron Beam Absorbed Current (EBAC), and EBIRCH (Electron Beam Induced Resistance CHange). The results demonstrate the value of using each for SRAM yield management. EBIC provides for imaging of depletion zones between p-wells and n-wells, even in a planar view. EBAC can provide information on basic connectivity as well as enabling isolation of resistive areas along a conductor. EBIRCH, being driven by two different mechanisms (thermal coefficient of resistivity and Seebeck effect) can provide two different analysis types, depending on conditions. EBIRCH not only precisely isolated the fin responsible for a short, but also highlighted the thermal relations between the elements of a pulldown device in an SRAM. These techniques together provide multiple forms of process feedback in an integrated yield management program involving analysis of via chains, SRAM parallel array test structures, and SRAMs.
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