V. Stavrov, G. Stavreva, E. Tomerov, D. Gieva, R. Radonov
{"title":"项目MECA:压阻反馈微系统培训课程","authors":"V. Stavrov, G. Stavreva, E. Tomerov, D. Gieva, R. Radonov","doi":"10.1109/SIITME.2017.8259856","DOIUrl":null,"url":null,"abstract":"This paper presents a training course on practical aspects in design, technology and prototype fabrication of microsystems with piezoresistive feedback, exploiting the shared infrastructure. The course content is considered in the scope of building a sustainable Knowledge Alliance between the partners in Erasmus+ Project# 562206-EPP-1-2015-1-BG-EPPKA2-KA — MECA.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"241 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Project MECA: Training course in microsystems with piezoresistive feedback\",\"authors\":\"V. Stavrov, G. Stavreva, E. Tomerov, D. Gieva, R. Radonov\",\"doi\":\"10.1109/SIITME.2017.8259856\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a training course on practical aspects in design, technology and prototype fabrication of microsystems with piezoresistive feedback, exploiting the shared infrastructure. The course content is considered in the scope of building a sustainable Knowledge Alliance between the partners in Erasmus+ Project# 562206-EPP-1-2015-1-BG-EPPKA2-KA — MECA.\",\"PeriodicalId\":138347,\"journal\":{\"name\":\"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"volume\":\"241 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SIITME.2017.8259856\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIITME.2017.8259856","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Project MECA: Training course in microsystems with piezoresistive feedback
This paper presents a training course on practical aspects in design, technology and prototype fabrication of microsystems with piezoresistive feedback, exploiting the shared infrastructure. The course content is considered in the scope of building a sustainable Knowledge Alliance between the partners in Erasmus+ Project# 562206-EPP-1-2015-1-BG-EPPKA2-KA — MECA.