采用20nm异质结隧道效应设计高能效逻辑门

Harshita Vallabhaneni, A. Japa, Sadulla Shaik, K. Rama Krishna, R. Vaddi
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引用次数: 11

摘要

本文介绍了20nm异质结隧道晶体管(HTFET)作为设计节能逻辑门的陡坡器件的设计见解和基准测试。20nm Si FinFET技术已被用于HTFET电路性能的基准测试。HTFET逻辑拓扑比Si FinFET拓扑具有更好的鲁棒性和能量效率,特别是在小电源电压下。这项工作进一步探讨了基于高温场效应晶体管的级联逆变器链驱动大容性负载的分析。研究表明,基于高温场效应晶体管的电路设计为在小电源电压下CMOS技术无法实现的高能效逻辑设计开辟了道路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Designing energy efficient logic gates with Hetero junction Tunnel fets at 20nm
This paper presents the design insights and benchmarking of 20nm Hetero-junction Tunnel transistor (HTFET) as steep slope device for designing energy efficient logic gates. 20nm Si FinFET technology has been used for benchmarking HTFET circuit performance. The HTFET logic topologies have improved robustness and energy efficiency over Si FinFET topology, particularly for small supply voltages. This work further explores the analysis of HTFET based cascaded chain of inverters to drive a large capacitive load. It has been demonstrated that HTFET based circuit design opens path for energy efficient logic design not achievable with CMOS technology at small supply voltages.
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