用于冷却单个倒装电子模块的减小间隙热膏封装设计

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI:10.1109/ITHERM.2002.1012516

K. Sikka, H. Toy, D. Edwards, S. Iruvanti, E. Ingalls, P. Dehaven

{"title":"用于冷却单个倒装电子模块的减小间隙热膏封装设计","authors":"K. Sikka, H. Toy, D. Edwards, S. Iruvanti, E. Ingalls, P. Dehaven","doi":"10.1109/ITHERM.2002.1012516","DOIUrl":null,"url":null,"abstract":"A method of reducing the thermal paste chip-to-cap interface gap is presented to achieve enhanced cooling of single flip-chip electronic modules. The structure and assembly process steps of the gap reduction design are described. The thermal reliability of the design is evaluated by measuring the thermal resistance for several permutations of the structural design variables, allowing identification of an optimum design configuration.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Gap-reduced thermal paste package design for cooling single flip-chip electronic modules\",\"authors\":\"K. Sikka, H. Toy, D. Edwards, S. Iruvanti, E. Ingalls, P. Dehaven\",\"doi\":\"10.1109/ITHERM.2002.1012516\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method of reducing the thermal paste chip-to-cap interface gap is presented to achieve enhanced cooling of single flip-chip electronic modules. The structure and assembly process steps of the gap reduction design are described. The thermal reliability of the design is evaluated by measuring the thermal resistance for several permutations of the structural design variables, allowing identification of an optimum design configuration.\",\"PeriodicalId\":299933,\"journal\":{\"name\":\"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)\",\"volume\":\"44 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2002.1012516\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012516","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

提出了一种减小热膏晶盖界面间隙的方法，以实现对单个倒装电子模块的增强冷却。介绍了减隙设计的结构和装配工艺步骤。通过测量结构设计变量的几种排列的热阻来评估设计的热可靠性，从而确定最佳设计配置。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Gap-reduced thermal paste package design for cooling single flip-chip electronic modules

A method of reducing the thermal paste chip-to-cap interface gap is presented to achieve enhanced cooling of single flip-chip electronic modules. The structure and assembly process steps of the gap reduction design are described. The thermal reliability of the design is evaluated by measuring the thermal resistance for several permutations of the structural design variables, allowing identification of an optimum design configuration.

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来源期刊

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)

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