液晶聚合物中温敏电容式RF MEMS开关的低成本本地化封装方法

M. Morton, N. Kingsley, J. Papapolymerou
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引用次数: 6

摘要

这项工作展示了一种低成本的液晶聚合物(LCP)局部加热封装方法,用于温度敏感器件,如电容式RF MEMS开关。对加热元件的结构进行了模拟,以检查键合区和开关的热特性。加热线是用铜包层在LCP上制造的,只需要一个光刻和蚀刻步骤。MEMS空腔由两个1 mil的低温LCP层形成,并用CO2激光系统蚀刻。通过将7 A直流电流通过加热元件同时将4层压缩在一起,这些层通过局部加热粘合在一起。将粘接开关浸入60℃水中24小时,测试密封质量。之前和之后的测量显示,提供一个成功的键的证据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low Cost Method for Localized Packaging of Temperature Sensitive Capacitive RF MEMS Switches in Liquid Crystal Polymer
This work demonstrates a low cost localized heating packaging method on liquid crystal polymer (LCP) for temperature sensitive devices such as the capacitive RF MEMS switch. Simulations of the heating element structures are performed to examine the thermal characteristics of the bonded regions and switch. Heating lines are fabricated on LCP using the copper cladding, requiring only one photolithography and etch step. The MEMS cavity is formed with two 1 mil layers of low-temp LCP that are etched with a CO2 laser system. The layers are bonded with localized-heating by passing 7 A of DC current through the heating element while compressing the 4 layers together. The bonded switch is submerged in 60degC water for 24 hours to test seal quality. Before and after measurements are shown, providing evidence of a successful bond.
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