全无铅IGBT模块，可靠性卓越

Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005. Pub Date : 2005-05-23 DOI:10.1109/ISPSD.2005.1487955

Y. Nishimura, K. Oonishi, A. Morozumi, E. Mochizuki, Y. Takahashi

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引用次数: 18

摘要

IGBT模块无铅焊料应用的主题是绝缘衬底下焊料在温度循环试验中的可靠性。本文介绍了具有优良可靠性的全无铅IGBT模块。这是通过优化绝缘衬底的热膨胀系数和使用Sn-Ag-In焊料实现的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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All lead free IGBT module with excellent reliability

The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT modules with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.

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Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.

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