英特尔长春藤桥揭幕——第一款商用三门、高k、金属门CPU

D. James
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引用次数: 62

摘要

2007年,第一批高k/金属门(HKMG)设备进入市场。这标志着自20世纪70年代早期多晶硅栅极普及以来,金属栅极技术首次在硅上回归。英特尔是第一个在其45纳米产品中使用高k/金属栅极的公司。其他领先的制造商现在已经推出了栅极优先和栅极后两种形式的HKMG产品,现在第一个22纳米FinFET产品已经进入市场-英特尔常春藤桥CPU。Chipworks作为半导体和电子行业竞争情报的供应商,监控芯片工艺进入商业生产的演变。Chipworks已经获得了该前沿部件的样品,并进行了结构分析,以检查该设备的特征和制造过程。本文讨论了我们在芯片内看到的一些不同的特征,并说明了三栅极晶体管的结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Intel Ivy Bridge unveiled — The first commercial tri-gate, high-k, metal-gate CPU
The year 2007 saw the introduction of the first high-k/metal gate (HKMG) devices into the marketplace. This marked the return of metal-gate technology on silicon for the first time since polysilicon gates became ubiquitous in the early 1970s. Intel was the first to use high-k/metal gate in its 45-nm product. Other leading-edge manufacturers have now launched HKMG products in both gate-first and gate-last forms, and now the first 22-nm FinFET products have come onto the market - the Intel Ivy Bridge CPU. Chipworks, as a supplier of competitive intelligence to the semiconductor and electronics industries, monitors the evolution of chip processes as they come into commercial production. Chipworks has obtained samples of this leading-edge part and performed structural analyses to examine the features and manufacturing processes of the device. This paper discusses some of the different features we have seen within the chip, and illustrates the structure of the tri-gate transistors.
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