将层状镝(Dy2O3)介电体掺入HfO2栅极堆改善MOSFET特性

Tackhwi Lee, S. Rhee, C. Kang, F. Zhu, Manhong Zhang, H. Kim, C. Choi, I. Ok, S. Koveshnikov, Hokyung Park, Jack C. Lee
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引用次数: 0

摘要

首次研究了Dy2O3掺杂HfO2多金属氧化物n- mosfet的新结构方法及其电学特性。与对照HfO2相比,顶部Dy2O3层合HfO2双层结构的EOT最薄,漏电流更小。改进的电气特性,如更低的VT,更高的驱动电流和通道电子迁移率。此外,在Dy2O3/HfO2结构中,获得了更好的VT不稳定性,减少了介电电荷捕获,减少了TaN金属栅电极的Ta穿透。最后,减少声子散射被发现是高通道迁移率的合理机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improved MOSFET characteristics by Incorporating Laminated Dysprosium (Dy2O3) Dielectric into HfO2 Gate Stack
New structural approach of Dy2O3 incorporated HfO2 multi-metal oxide n-MOSFETs and their electrical characterization are investigated for the first time. Top Dy2O3 laminated HfO2 bi-layer structure shows the thinnest EOT with reduced leakage current compared to control HfO2. Improved electrical characteristics such as lower VT, higher drive current and channel electron mobility are demonstrated. In addition, better VT instabilities, reduced dielectric charge trapping, and less Ta penetration from TaN metal gate electrode are obtained in Dy2O3/HfO2 structure. Finally, reduced phonon scattering is found to be the plausible mechanism for higher channel mobility.
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