用分割C-V和常规方法研究商用功率mosfet的辐照损伤

S. Mileusnic, M. Zivanov, P. Habaš
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引用次数: 2

摘要

电荷积累和界面态的产生是金属氧化物半导体器件中最重要的退化因素。传统的测定MOS结构辐射硬度的方法需要进行破坏性测试。在这项研究中,我们通过通常采用的方法,如电荷泵浦(CP), I-V和分裂C-V技术,进行了商用功率MOSFET表征的测试。测量结果证实了理论预期,但也出现了一些意想不到的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A study of irradiation damage in commercial power MOSFETs by means of split C-V and conventional methods
Charge build-up and generation of interface states are the most important degradation factors in metal-oxide-semiconductor devices. Traditional methods to determine the radiation hardness of MOS structures require destructive testing. In this study we performed tests for commercial power MOSFET characterization by means of generally adopted methods like charge pumping (CP), I-V and split C-V techniques. Results of measurements confirm theoretical expectations but some unexpected effects also occurred.
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