半导体智能制造中基于SECS/GEM的动态AI计算任务

H. H. Nguyen
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引用次数: 0

摘要

半导体制造业的数据管理系统由多层组成,包括云层、边缘层和设备或器件层,它们在系统中执行不同的功能。设备层负责数据监控和故障检测,云层和边缘层负责执行计算任务。设备层计算任务的性能是有益的,因为它们有助于实现对生产的实时响应,并减少从设备层到边缘或云层的数据传输所造成的延迟。在半导体制造中,位于边缘层的主机通过sec /Gem通信协议与设备通信。根据我们的实验结果,在设备层面进行数据分析更加高效和有效。本文提出了一种新的Secs/Gem协议,用于在设备上执行动态AI任务。该协议允许主机动态分配数据分析任务给设备,设备将分析结果报告给主机。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Dynamic AI Computation Tasks with SECS/GEM in Semiconductor Smart Manufacturing
Semiconductor manufacturing has data management systems comprising multiple layers, including the cloud layer, the edge layer, and the equipment or device layer, which perform different functions in the system. The equipment layer performs data monitoring and detection of faults-the cloud layer and the edge layer help perform computational tasks. Performance of the computational tasks at the equipment layer is beneficial because they help achieve real-time response to the production and reduce the delays caused by data transfer from the equipment layer to the edge or cloud layer. In semiconductor manufacturing, the host computer located at the edge layer communicates to the equipment through Secs/Gem communication protocol. According to the results from our experiment, it is more efficient and effective to perform data analysis at the equipment level. This paper proposes a new Secs/Gem protocol for performing dynamic AI tasks on the equipment. The protocol allows the host to dynamically assign tasks of analyzing data to the equipment, and the equipment reports the results back to the host.
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