{"title":"随机电报噪声分析作为一种工具,将物理设备特征与纳米级设备的电气可靠性联系起来","authors":"F. Puglisi","doi":"10.1109/IIRW.2016.7904891","DOIUrl":null,"url":null,"abstract":"In this work, we report a detailed discussion on the techniques and the requirements needed to enable Random Telegraph Noise (RTN) analysis as a tool to investigate device reliability. Starting with the understanding of the RTN signal properties, a set of best practices to perform measurements and data analysis is established to guarantee reliable results and a correct ensuing physical interpretation. It will be shown that combining dedicated and careful experiments with refined data analysis and comprehensive physics simulations is hence required to enable RTN analysis as a safe and innovative investigation tool for electron devices. The effectiveness of RTN analysis as an investigation tool is demonstrated on both FinFET and resistive memory devices: the parameters of RTN as observed in the experiments performed on FinFETs allow understanding the details of the defects generation during stress in such devices; RTN analysis on RRAM allows understanding the physical origin of RTN in these devices and to estimate the physical properties of defects involved in the phenomenon.","PeriodicalId":436183,"journal":{"name":"2016 IEEE International Integrated Reliability Workshop (IIRW)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Random Telegraph Noise analysis as a tool to link physical device features to electrical reliability in nanoscale devices\",\"authors\":\"F. Puglisi\",\"doi\":\"10.1109/IIRW.2016.7904891\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, we report a detailed discussion on the techniques and the requirements needed to enable Random Telegraph Noise (RTN) analysis as a tool to investigate device reliability. Starting with the understanding of the RTN signal properties, a set of best practices to perform measurements and data analysis is established to guarantee reliable results and a correct ensuing physical interpretation. It will be shown that combining dedicated and careful experiments with refined data analysis and comprehensive physics simulations is hence required to enable RTN analysis as a safe and innovative investigation tool for electron devices. The effectiveness of RTN analysis as an investigation tool is demonstrated on both FinFET and resistive memory devices: the parameters of RTN as observed in the experiments performed on FinFETs allow understanding the details of the defects generation during stress in such devices; RTN analysis on RRAM allows understanding the physical origin of RTN in these devices and to estimate the physical properties of defects involved in the phenomenon.\",\"PeriodicalId\":436183,\"journal\":{\"name\":\"2016 IEEE International Integrated Reliability Workshop (IIRW)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Integrated Reliability Workshop (IIRW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IIRW.2016.7904891\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Integrated Reliability Workshop (IIRW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIRW.2016.7904891","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Random Telegraph Noise analysis as a tool to link physical device features to electrical reliability in nanoscale devices
In this work, we report a detailed discussion on the techniques and the requirements needed to enable Random Telegraph Noise (RTN) analysis as a tool to investigate device reliability. Starting with the understanding of the RTN signal properties, a set of best practices to perform measurements and data analysis is established to guarantee reliable results and a correct ensuing physical interpretation. It will be shown that combining dedicated and careful experiments with refined data analysis and comprehensive physics simulations is hence required to enable RTN analysis as a safe and innovative investigation tool for electron devices. The effectiveness of RTN analysis as an investigation tool is demonstrated on both FinFET and resistive memory devices: the parameters of RTN as observed in the experiments performed on FinFETs allow understanding the details of the defects generation during stress in such devices; RTN analysis on RRAM allows understanding the physical origin of RTN in these devices and to estimate the physical properties of defects involved in the phenomenon.