为最新的包装设计底填材料

2018 International Symposium on Semiconductor Manufacturing (ISSM) Pub Date : 2018-12-01 DOI:10.1109/issm.2018.8651155

O. Suzuki, T. Enomoto, K. Kotaka

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引用次数: 0

摘要

本文讨论了毛细下填体的侵彻能力和应力特性。CUF的组成材料表征了CUF的液态和固态。根据间隙的大小，填料尺寸必须优化。解释了CUF传递应力的机理。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Design of underfill materials for the latest package

In this paper, penetration capability and stress behavior of capillary underfill (CUF) is discussed. The constituent materials of the CUF characterize both the liquid state and the solid state of CUF. Depending on the size of clearance gap, filler size must be optimized. The mechanism of stress transmission by CUF is explained.

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来源期刊

2018 International Symposium on Semiconductor Manufacturing (ISSM)

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