增加冷却功率的微型热电模块

V. Semenyuk
{"title":"增加冷却功率的微型热电模块","authors":"V. Semenyuk","doi":"10.1109/ICT.2006.331216","DOIUrl":null,"url":null,"abstract":"Progress in developing high cooling power, short-legged thermoelectric coolers (TECs) for local cooling of high power density electro-optic components is represented. Different competitive methods aimed toward TEC miniaturization, such as processing of bulk materials as well as thin-film and thick-film technique, are analyzed and their advantages and disadvantages are discussed. Bulk material based technology is developed which allow production of TECs with TE leg height below 0.2 mm. The TECs show temperature differences comparable to those for standard bulk coolers","PeriodicalId":346555,"journal":{"name":"2006 25th International Conference on Thermoelectrics","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"Miniature Thermoelectric Modules with Increased Cooling Power\",\"authors\":\"V. Semenyuk\",\"doi\":\"10.1109/ICT.2006.331216\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Progress in developing high cooling power, short-legged thermoelectric coolers (TECs) for local cooling of high power density electro-optic components is represented. Different competitive methods aimed toward TEC miniaturization, such as processing of bulk materials as well as thin-film and thick-film technique, are analyzed and their advantages and disadvantages are discussed. Bulk material based technology is developed which allow production of TECs with TE leg height below 0.2 mm. The TECs show temperature differences comparable to those for standard bulk coolers\",\"PeriodicalId\":346555,\"journal\":{\"name\":\"2006 25th International Conference on Thermoelectrics\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 25th International Conference on Thermoelectrics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICT.2006.331216\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 25th International Conference on Thermoelectrics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICT.2006.331216","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 20

摘要

介绍了用于高功率密度电光器件局部冷却的高冷却功率短腿热电冷却器的研究进展。分析了不同的TEC小型化竞争方法,如块状材料加工、薄膜技术和厚膜技术,并讨论了它们的优缺点。开发了基于散装材料的技术,允许生产TE腿高低于0.2 mm的tec。tec显示的温差与标准散装冷却器相当
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Miniature Thermoelectric Modules with Increased Cooling Power
Progress in developing high cooling power, short-legged thermoelectric coolers (TECs) for local cooling of high power density electro-optic components is represented. Different competitive methods aimed toward TEC miniaturization, such as processing of bulk materials as well as thin-film and thick-film technique, are analyzed and their advantages and disadvantages are discussed. Bulk material based technology is developed which allow production of TECs with TE leg height below 0.2 mm. The TECs show temperature differences comparable to those for standard bulk coolers
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