Multilevel finite difference methods for the characterization of substrate coupling in deep sub-micron designs

Accurate modeling of noise coupling effects due to crosstalk via the substrate is an increasingly important concern for the design and verification of analog, digital and mixed analog-digital systems. In this paper we present a technique for model characterization that is based on a finite difference formulation whose solution is accelerated by means of a multilevel method. This technique can be used for accurate and efficient extraction of substrate coupling parameters in deep sub-micron designs.