{"title":"热管理先进复合材料概述","authors":"C. Zweben","doi":"10.1109/ISAPM.1998.664458","DOIUrl":null,"url":null,"abstract":"A variety of new, advanced composites are now available which provide great advantages over conventional materials for thermal control and electronic packaging. This brief paper provides an overview of advanced composites used in thermal management, including properties, applications and future trends. The focus is on materials that have thermal conductivities that are at least as high as those of aluminum alloys.","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Overview of advanced composites for thermal management\",\"authors\":\"C. Zweben\",\"doi\":\"10.1109/ISAPM.1998.664458\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A variety of new, advanced composites are now available which provide great advantages over conventional materials for thermal control and electronic packaging. This brief paper provides an overview of advanced composites used in thermal management, including properties, applications and future trends. The focus is on materials that have thermal conductivities that are at least as high as those of aluminum alloys.\",\"PeriodicalId\":354229,\"journal\":{\"name\":\"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAPM.1998.664458\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.1998.664458","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Overview of advanced composites for thermal management
A variety of new, advanced composites are now available which provide great advantages over conventional materials for thermal control and electronic packaging. This brief paper provides an overview of advanced composites used in thermal management, including properties, applications and future trends. The focus is on materials that have thermal conductivities that are at least as high as those of aluminum alloys.