一种用于4H-SiC平面功率mosfet的新型单元拓扑及其与六边形和八边形单元拓扑的比较

Shengnan Zhu, Tianshi Liu, Arash Salemi, Michael Jin, M. White, David Sheridan, A. Agarwal
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摘要

设计了一种新的用于4H-SiC平面功率mosfet的十二角(十二个边的多边形,简称Dod)单元拓扑结构。Dod单元用于650 V SiC mosfet的布局设计。标称六角(Hex)电池和最近公布的八角形(Oct)电池也用于650 V SiC MOSFET布局设计进行比较。这些器件被制造、切割和封装,用于静态和动态表征。实验结果表明,该六单元MOSFET具有最低的比导通电阻(Ron,sp),适合大功率应用。Dod和Oct-cell mosfet具有比Hex-cell mosfet小得多的栅极漏极电容,使其成为高频应用的良好候选者。与Oct电池相比,新的Dod电池设计了优化的通道密度,降低了Ron,sp。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A New Cell Topology for 4H-SiC Planar Power MOSFETs and Comparison with Hexagonal and Octagonal Cell Topologies
A new Dodecagonal (polygon with twelve sides, short for Dod) cell topology is designed for 4H-SiC planar power MOSFETs. The Dod cell is used in the layout design of the 650 V SiC MOSFETs. The nominal Hexagonal (Hex) cell and a recently published Octagonal (Oct) cell are also used on the 650 V SiC MOSFET layout designs for comparisons. The devices are fabricated, diced, and packaged for static and dynamic characterizations. Experimental results show that the Hex-cell MOSFET has the lowest specific ON-resistance (Ron,sp) and is suitable for high-power applications. The Dod and Oct-cell MOSFETs have much smaller gate-drain capacitance than Hex-cell MOSFETs, making them good candidates for high-frequency applications. The new Dod cell is designed with optimized channel density to have reduced Ron,sp compared to the Oct cell.
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