SRAM单元应用的TSNWFET:性能变化和过程依赖

S. Suk, Y. Yeoh, Ming Li, K. Yeo, S. Kim, Dong Won Kim, Donggun Park, Won-Seoung Lee
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引用次数: 26

摘要

与VG-VTH = 1 V时12/12 nm纳米线宽度/高度(W/H)相比,12/24 nm纳米线宽度/高度(W/H)下离子增加约25%。在此基础上,我们首次成功制备了W/H为5/15 nm、LG为40 nm的NW SRAM阵列。在VD = 1 V时,静态噪声裕度(SNM)达到325 mV。研究了n-ch双硅纳米线MOSFET (TSNWFET)的NW高度和栅极氧化物厚度随器件变化的关系。在TSNWFET中,线边缘粗糙度和尺寸变化比掺杂物的随机波动更为重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
TSNWFET for SRAM cell application: Performance variation and process dependency
ION is increased about 25 % with the width/height (W/H) of 12/24 nm nanowire (NW) in comparison with the W/H of 12/12 nm at VG-VTH = 1 V. With these results, we have successfully fabricated NW SRAM arrays with the W/H of 5/15 nm and LG of 40 nm for the first time. Static noise margin (SNM) of 325 mV is achieved at VD = 1 V. NW height and gate oxide thickness dependency of n-ch twin silicon nanowire MOSFET (TSNWFET) on device variations is investigated. Line edge roughness and size variation are more critical than random dopant fluctuation in TSNWFET.
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