热辅助自旋传递扭矩存储器(STT-RAM)电池设计探索

Hai Helen Li, Haiwen Xi, Yiran Chen, J. Stricklin, Xiaobin Wang, Tong Zhang
{"title":"热辅助自旋传递扭矩存储器(STT-RAM)电池设计探索","authors":"Hai Helen Li, Haiwen Xi, Yiran Chen, J. Stricklin, Xiaobin Wang, Tong Zhang","doi":"10.1109/ISVLSI.2009.17","DOIUrl":null,"url":null,"abstract":"Thermal-assisted spin-transfer torque random access memory (STT-RAM) has been considered as a promising candidate of next-generation nonvolatile memory technology. We conducted finite element simulation on thermal dynamics in the programming process of thermal-assisted STT-RAM. Special attentions have been paid to the scalability and design space of the thermal-assist programming scheme by varying the memory element dimension and resistance-area product. We also provide systematic analysis and comparison between the thermal-assisted STT-RAM and standard STT-RAM. Discussions on the writeability and scalability of thermal-assisted STT-RAM are also conducted.","PeriodicalId":137508,"journal":{"name":"2009 IEEE Computer Society Annual Symposium on VLSI","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Thermal-Assisted Spin Transfer Torque Memory (STT-RAM) Cell Design Exploration\",\"authors\":\"Hai Helen Li, Haiwen Xi, Yiran Chen, J. Stricklin, Xiaobin Wang, Tong Zhang\",\"doi\":\"10.1109/ISVLSI.2009.17\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermal-assisted spin-transfer torque random access memory (STT-RAM) has been considered as a promising candidate of next-generation nonvolatile memory technology. We conducted finite element simulation on thermal dynamics in the programming process of thermal-assisted STT-RAM. Special attentions have been paid to the scalability and design space of the thermal-assist programming scheme by varying the memory element dimension and resistance-area product. We also provide systematic analysis and comparison between the thermal-assisted STT-RAM and standard STT-RAM. Discussions on the writeability and scalability of thermal-assisted STT-RAM are also conducted.\",\"PeriodicalId\":137508,\"journal\":{\"name\":\"2009 IEEE Computer Society Annual Symposium on VLSI\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE Computer Society Annual Symposium on VLSI\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISVLSI.2009.17\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Computer Society Annual Symposium on VLSI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISVLSI.2009.17","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

摘要

热辅助自旋传递扭矩随机存取存储器(STT-RAM)被认为是下一代非易失性存储技术的一个有前途的候选人。我们对热辅助STT-RAM编程过程中的热动力学进行了有限元模拟。通过改变存储单元的尺寸和电阻面积积,特别关注了热辅助编程方案的可扩展性和设计空间。我们还对热辅助STT-RAM和标准STT-RAM进行了系统的分析和比较。讨论了热辅助STT-RAM的可写性和可扩展性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal-Assisted Spin Transfer Torque Memory (STT-RAM) Cell Design Exploration
Thermal-assisted spin-transfer torque random access memory (STT-RAM) has been considered as a promising candidate of next-generation nonvolatile memory technology. We conducted finite element simulation on thermal dynamics in the programming process of thermal-assisted STT-RAM. Special attentions have been paid to the scalability and design space of the thermal-assist programming scheme by varying the memory element dimension and resistance-area product. We also provide systematic analysis and comparison between the thermal-assisted STT-RAM and standard STT-RAM. Discussions on the writeability and scalability of thermal-assisted STT-RAM are also conducted.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信