实现100纳米以下mosfet的挑战

A. Tasch
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引用次数: 11

摘要

在过去的25-30年里,MOS晶体管不断缩小到更小的特征尺寸是集成电路取得显著进步的主要因素。这是由于越来越小的设备使得集成和性能水平持续快速提高。虽然在实验室中已经构建了低于100纳米的mosfet,但将mosfet扩展到100纳米以下绝不是直截了当的,因此将保持集成电路性能,可靠性和可制造性的持续显着(成本合理)改进。本次演讲的重点是在设计和制造栅极长度低于100纳米的mosfet时遇到的主要挑战。研究了对结构及其组成部分的要求,并讨论了可能的解决方案。一些挑战和障碍的解决方案将需要革命性的方法和巨大的研发资源和人才。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The challenges in achieving sub-100 nm MOSFETs
The continued scaling of the MOS transistor to smaller feature sizes has been the prime factor in the remarkable advancements in integrated circuits over the past 25-30 years. This is due to the fact that successively smaller devices have allowed continued rapid improvements in the level of integration and performance. While sub-100 nm MOSFETs have been built in the laboratory, it is by no means straightforward to extend MOSFETs below 100 nm such that continued notable (cost justified) improvements in integrated circuit performance, reliability, and manufacturability will be maintained. This talk focuses on the major challenges that are encountered in designing and building MOSFETs with sub 100 nm gate lengths. The requirements on the structure and its component parts are examined, and potential solutions are discussed. Solutions to some of the challenges and obstacles will require revolutionary approaches and tremendous research and development resources and talent.
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