高性能asic的I/O阻抗匹配算法

Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334) Pub Date : 1997-09-07 DOI:10.1109/ASIC.1997.617019

P. Zuchowski, J. H. Panner, D. Stout, J. Adams, F. Chan, P. Dunn, A. D. Huber, J. J. Oler

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引用次数: 11

摘要

本文讨论了一种设计风格，该设计风格利用倒装芯片焊接凸点连接的面积阵列，实现可编程阻抗匹配算法的I/O电路设计，以及在芯片布局，芯片检查和释放到制造过程中必须利用这些功能的设计系统。最后给出了一种新型测试芯片的测试结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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I/O impedance matching algorithm for high-performance ASICs

This paper discusses a design style that utilizes an area array of flip-chip solder bump connections, I/O circuit designs that implement a programmable impedance matching algorithm, and a design system that must utilize these features during chip layout, chip checking, and release to manufacturing. Results from a recent test chip are also given.

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来源期刊

Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)

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