不同工作压力下倾斜溅射靶大功率脉冲磁控溅射沉积AlN薄膜

Z. Azman, N. Nayan, A. Bakar, Zamri Yusop, M. H. Mamat, Muliana Tahan, N. Sahari, M. Y. Ahmad
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引用次数: 1

摘要

采用倾斜溅射靶的HiPIMS方法,在3、5和10 mTorr三种不同的工作压力下沉积A1N薄膜。XRD谱图显示制备的a轴A1N薄膜接近单晶。FESEM横截面图像显示,A1N薄膜的生长速率随工作压力的减小而增大。在3 mTorr、5 mTorr和10 mTorr下,A1N薄膜的厚度分别为267 nm、221nm和183 nm。在较低的工作压力下,结晶度较高,为64.3%,在10 mTorr下,结晶度降至52.02%。然而,随着工作压力的增加,单晶a轴A1N主导峰的微应变和位错密度有所提高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Deposition of AlN Thin Film by High-Power Impulse Magnetron Sputtering with Tilted Sputter Target at Different Working Pressure
The deposition of A1N thin film was conducted in three different working pressures of 3, 5 and 10 mTorr by HiPIMS method with tilted sputter target. XRD pattern shows nearly single crystalline of a-axis A1N thin films were produced. A1N thin film growth rate increase with the decrease of working pressure as agreed by FESEM cross-sectional images. The thickness of A1N thin film observed at 267 nm, 221nm, and 183 nm for 3 mTorr, 5 mTorr and 10 mTorr, respectively. The degree of crystallinity was observed higher at lower working pressure at 64.3% and reduced to 52.02% at 10 mTorr. However, the micro strain and dislocation density were observed improved over the increase of working pressure referring to single-crystalline a-axis A1N dominant peak.
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