MEMS封装领域概述及发展趋势

Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090) Pub Date : 2001-01-21 DOI:10.1109/MEMSYS.2001.906464

H. Reichl, V. Grosser

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引用次数: 91

摘要

微机电系统(MEMS)封装价格昂贵，且产品和应用特定。集成电路的单芯片封装仅适用于某些微系统。低成本MEMS封装的重点是晶圆级封装(WLP)。在集成电路封装中也观察到相同的趋势。芯片尺寸封装(CSP)是由WLP制造的。未来的微电子系统将以晶圆级组装的方式在一个基本晶片上组装多个元件。系统上包(SOP)技术，包括三维三次积分将被使用。针对MEMS封装，提出了模块化MEMS系统集成(MOMEMS)方案。CSP封装MEMS模块堆叠的三次集成有助于低体积微系统的经济实现。

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Overview and development trends in the field of MEMS packaging

Micro Electro Mechanical Systems (MEMS) packaging is expensive and product and application specific. Single chip packages for IC's are only for some microsystems applicable. Cost efficient MEMS packaging focuses wafer level packaging (WLP). An identical trend is observed in IC packaging. Chip size packages (CSP) are fabricated by WLP. Future microelectronic system will be fabricated by wafer level assembly of multiple components on a base chip. System on package (SOP) techniques including 3D cubic integration will be used. For MEMS packaging a Modular MEMS system integration (MOMEMS) is proposed. Cubic integration by stacking of CSP packaged MEMS modules contribute to an economic realization of low volume microsystems.

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Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090)

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