Thermal/mechanical design and design automation for packaging

The need for mechanical and thermal analysis/synthesis is motivated through examples of applications. The development cycle for design is discussed in some detail and the criticality of comprehensive analysis to ensure successful design is discussed. It is demonstrated that successful integration of diverse functional and reliability requirements requires thorough studies of design options. The current state of the art in design synthesis and analysis tools is reviewed. It is suggested that design tools still need improvements in connectivity between electrical layout and thermal and mechanical analysis/synthesis tools. Another issue that needs greater emphasis is the issue of dimensional scale transitions in analyses at the die level vs those at the package and system levels. Both these issues are reviewed in context of the ability of current tools. Some challenges as we go forward are identified based on this review.