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半导体微结构的热弹性研究

2008 International Conference on Perspective Technologies and Methods in MEMS Design Pub Date : 2008-05-21 DOI:10.1109/MEMSTECH.2008.4558750
K. Konstantin, P. Román
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引用次数: 1

摘要

本文介绍了半导体结构MEMS热弹性的研究成果。设计了用于微结构热弹性研究的解析模型。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Research of a thermoelasticity of semiconducting microstructures
In paper the outcomes of research of a thermoelasticity of semiconducting structures MEMS represented. The analytical model for research of a thermoelasticity of microstructures designed.
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2008 International Conference on Perspective Technologies and Methods in MEMS Design
2008 International Conference on Perspective Technologies and Methods in MEMS Design
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