高性能混合信号技术的电路器件协同设计

S. Saxena, P. McNamara, A. Shibkov, V. Axelrad, C. Guardiani
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引用次数: 1

摘要

片上系统设计需要低成本的模拟和数字模块集成。通常,在器件设计周期的早期没有充分考虑模拟需求,导致器件不适合模拟组件。本文提出了一种创新的方法,基于一组考虑模拟和数字要求的性能图电路,推导出全面的设备规格。通过将这些规范用于器件设计,可以更有效地共同开发混合信号处理、库和产品。并以先进的120纳米CMOS技术为例说明了该方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Circuit-device co-design for high performance mixed-signal technologies
System-on-chip designs require low cost integration of analog and digital blocks. Often, the analog requirements are not considered sufficiently early in the device design cycle, resulting in devices that are suboptimal for the analog components. This paper presents an innovative methodology for deriving comprehensive device specifications based upon a set of figure-of-merit circuits which account for both analog and digital requirements. By utilizing these specifications for device design, a more efficient codevelopment of mixed-signal processes, libraries and products is possible. The methodology is illustrated with an example based upon an advanced 120 nm CMOS technology.
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