使用高功率密度gan - hemt的x波段100w级宽带高功率放大器

Kei Fukunaga, Takumi Sugitani, Y. Yamaguchi, Daisuke Tsunami, M. Hangai, S. Shinjo
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引用次数: 1

摘要

本文提出了一种x波段100w级高功率放大器GaN单片微波集成电路。通过实现电场释放和高功率密度来提高放大器输出,研制出功率密度超过10 W/mm的氮化镓高电子迁移率晶体管(HEMT)。该高功率放大器GaN MMIC采用GaN HEMT制造,具有高功率密度。两级放大器MMIC的测量结果显示,输出功率为80-100 W,功率附加效率(PAE)为42%,增益为18 dB。该结果可与迄今为止报道的最先进的x波段MMIC功率放大器相媲美。这表明所开发的放大器在用于发射模块时具有优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
X-band 100 W-class Broadband High Power Amplifier Using High Power Density GaN-HEMTs
In this paper, an X-band 100 W class high power amplifier GaN monolithic microwave integrated circuit (MMIC) is presented. A GaN high electron mobility transistor (HEMT) with a power density exceeding 10 W/mm has been developed by achieving both electric field relief and high power density to increase the amplifier output. This high power amplifier GaN MMIC is manufactured using a GaN HEMT, which has high power density. Measurement results of the two-stage amplifier MMIC show output power of 80–100 W, a power added efficiency (PAE) of 42%, and a gain of 18 dB. This result is comparable with the best state-of-the-art X-band MMIC power amplifiers ever reported. This indicates that the developed amplifier has an advantage when it is utilized in a transmit module.
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