{"title":"中国国际电源管理制造服务供应商的绿色政策","authors":"W. Fang, Hongbo Yang, Ming Zhou, A. Tsui","doi":"10.1109/ICEPT.2007.4441473","DOIUrl":null,"url":null,"abstract":"Nowadays, power management semiconductor suppliers have taken big steps to provide environmentally sound and green product solutions to meet the ever increasing demand of high performance electronics in the global consumer, industrial, computer, communication and automotive markets. The challenges are two fold. Very strict reliability performance and the green requirements have to be met at the same time. These requirements mainly bring three challenges to current electronic device manufacturers: Lead-free plating process, green compound package and Pb-free die attach materials. GEM. as an international power management manufacturing services provider, has already taken action to meet the global new requirement. In tins paper, the research path and process improvement of green package manufacturing in GEM is presented, and the packaging trend of future high power and high thermal capability power management device is also discussed.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"97 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Green Policy in an International Power Management Manufacturing Services Provider in China\",\"authors\":\"W. Fang, Hongbo Yang, Ming Zhou, A. Tsui\",\"doi\":\"10.1109/ICEPT.2007.4441473\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nowadays, power management semiconductor suppliers have taken big steps to provide environmentally sound and green product solutions to meet the ever increasing demand of high performance electronics in the global consumer, industrial, computer, communication and automotive markets. The challenges are two fold. Very strict reliability performance and the green requirements have to be met at the same time. These requirements mainly bring three challenges to current electronic device manufacturers: Lead-free plating process, green compound package and Pb-free die attach materials. GEM. as an international power management manufacturing services provider, has already taken action to meet the global new requirement. In tins paper, the research path and process improvement of green package manufacturing in GEM is presented, and the packaging trend of future high power and high thermal capability power management device is also discussed.\",\"PeriodicalId\":325619,\"journal\":{\"name\":\"2007 8th International Conference on Electronic Packaging Technology\",\"volume\":\"97 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 8th International Conference on Electronic Packaging Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2007.4441473\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 8th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2007.4441473","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Green Policy in an International Power Management Manufacturing Services Provider in China
Nowadays, power management semiconductor suppliers have taken big steps to provide environmentally sound and green product solutions to meet the ever increasing demand of high performance electronics in the global consumer, industrial, computer, communication and automotive markets. The challenges are two fold. Very strict reliability performance and the green requirements have to be met at the same time. These requirements mainly bring three challenges to current electronic device manufacturers: Lead-free plating process, green compound package and Pb-free die attach materials. GEM. as an international power management manufacturing services provider, has already taken action to meet the global new requirement. In tins paper, the research path and process improvement of green package manufacturing in GEM is presented, and the packaging trend of future high power and high thermal capability power management device is also discussed.