中国国际电源管理制造服务供应商的绿色政策

W. Fang, Hongbo Yang, Ming Zhou, A. Tsui
{"title":"中国国际电源管理制造服务供应商的绿色政策","authors":"W. Fang, Hongbo Yang, Ming Zhou, A. Tsui","doi":"10.1109/ICEPT.2007.4441473","DOIUrl":null,"url":null,"abstract":"Nowadays, power management semiconductor suppliers have taken big steps to provide environmentally sound and green product solutions to meet the ever increasing demand of high performance electronics in the global consumer, industrial, computer, communication and automotive markets. The challenges are two fold. Very strict reliability performance and the green requirements have to be met at the same time. These requirements mainly bring three challenges to current electronic device manufacturers: Lead-free plating process, green compound package and Pb-free die attach materials. GEM. as an international power management manufacturing services provider, has already taken action to meet the global new requirement. In tins paper, the research path and process improvement of green package manufacturing in GEM is presented, and the packaging trend of future high power and high thermal capability power management device is also discussed.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"97 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Green Policy in an International Power Management Manufacturing Services Provider in China\",\"authors\":\"W. Fang, Hongbo Yang, Ming Zhou, A. Tsui\",\"doi\":\"10.1109/ICEPT.2007.4441473\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nowadays, power management semiconductor suppliers have taken big steps to provide environmentally sound and green product solutions to meet the ever increasing demand of high performance electronics in the global consumer, industrial, computer, communication and automotive markets. The challenges are two fold. Very strict reliability performance and the green requirements have to be met at the same time. These requirements mainly bring three challenges to current electronic device manufacturers: Lead-free plating process, green compound package and Pb-free die attach materials. GEM. as an international power management manufacturing services provider, has already taken action to meet the global new requirement. In tins paper, the research path and process improvement of green package manufacturing in GEM is presented, and the packaging trend of future high power and high thermal capability power management device is also discussed.\",\"PeriodicalId\":325619,\"journal\":{\"name\":\"2007 8th International Conference on Electronic Packaging Technology\",\"volume\":\"97 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 8th International Conference on Electronic Packaging Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2007.4441473\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 8th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2007.4441473","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

如今,电源管理半导体供应商已经迈出了重要的一步,提供环保和绿色的产品解决方案,以满足全球消费,工业,计算机,通信和汽车市场对高性能电子产品不断增长的需求。挑战是双重的。必须同时满足非常严格的可靠性性能和绿色要求。这些要求主要给目前的电子器件制造商带来了三个挑战:无铅电镀工艺、绿色复合封装和无铅贴片材料。宝石。作为一家国际化的电源管理制造服务提供商,我们已经采取行动来满足全球新的需求。本文介绍了GEM绿色封装制造的研究路径和工艺改进,并讨论了未来大功率高热能电源管理器件的封装趋势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Green Policy in an International Power Management Manufacturing Services Provider in China
Nowadays, power management semiconductor suppliers have taken big steps to provide environmentally sound and green product solutions to meet the ever increasing demand of high performance electronics in the global consumer, industrial, computer, communication and automotive markets. The challenges are two fold. Very strict reliability performance and the green requirements have to be met at the same time. These requirements mainly bring three challenges to current electronic device manufacturers: Lead-free plating process, green compound package and Pb-free die attach materials. GEM. as an international power management manufacturing services provider, has already taken action to meet the global new requirement. In tins paper, the research path and process improvement of green package manufacturing in GEM is presented, and the packaging trend of future high power and high thermal capability power management device is also discussed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信