Jaehyun Park, Chang-Jong Yim, Hye-in Yim, Jongmin Park, S. Park
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Optimized design and thermal/electrical characterization analysis of automotive power semiconductor switch modules using an inlay PCB
This paper proposes an optimized design plan through an electrical parasitic component analysis and thermal/structural analysis of automotive power semiconductor switch modules to which inlay PCBs are applied. In addition, a module was manufactured based on the analyzed contents to present comparatively analyzed results. We also proposed a design plan for optimization that can enhance overall performance through a structural rearrangement of the design.
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