T. K. Woodward, A. Krishnamoorthy, K. Goossen, J. A. Walker, A. Lentine, R. A. Novotny, L. D’asaro, L. Chirovsky, S. Hui, B. Tseng, D. Kossives, D. Dahringer, R. Leibenguth, J. Cunningham, W. Jan, D. Miller
{"title":"15 /spl mu/m的GaAs/AlGaAs MQW器件焊接到MOSIS 0.8 /spl mu/m CMOS,用于1gb /s双波束智能像素接收/发送","authors":"T. K. Woodward, A. Krishnamoorthy, K. Goossen, J. A. Walker, A. Lentine, R. A. Novotny, L. D’asaro, L. Chirovsky, S. Hui, B. Tseng, D. Kossives, D. Dahringer, R. Leibenguth, J. Cunningham, W. Jan, D. Miller","doi":"10.1109/ISSCC.1996.488737","DOIUrl":null,"url":null,"abstract":"A two-beam optical repeater circuit operates to 1 Gb/s, consumes 10 mW, occupies about 1100 /spl mu/m/sup 2/, and is realized with a technology capable of providing thousands of optical inputs and outputs to foundry-grade VLSI silicon CMOS circuitry. The technology provides this capability by attaching GaAs/AlGaAs multiple-quantum-well (MQW) modulators and detectors to VLSI CMOS with flip-chip solder bonding. The main unique features are summarized.","PeriodicalId":162539,"journal":{"name":"1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"15 /spl mu/m solder bonding of GaAs/AlGaAs MQW devices to MOSIS 0.8 /spl mu/m CMOS for 1 Gb/s two-beam smart-pixel receiver/transmitter\",\"authors\":\"T. K. Woodward, A. Krishnamoorthy, K. Goossen, J. A. Walker, A. Lentine, R. A. Novotny, L. D’asaro, L. Chirovsky, S. Hui, B. Tseng, D. Kossives, D. Dahringer, R. Leibenguth, J. Cunningham, W. Jan, D. Miller\",\"doi\":\"10.1109/ISSCC.1996.488737\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A two-beam optical repeater circuit operates to 1 Gb/s, consumes 10 mW, occupies about 1100 /spl mu/m/sup 2/, and is realized with a technology capable of providing thousands of optical inputs and outputs to foundry-grade VLSI silicon CMOS circuitry. The technology provides this capability by attaching GaAs/AlGaAs multiple-quantum-well (MQW) modulators and detectors to VLSI CMOS with flip-chip solder bonding. The main unique features are summarized.\",\"PeriodicalId\":162539,\"journal\":{\"name\":\"1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-02-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.1996.488737\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.1996.488737","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
15 /spl mu/m solder bonding of GaAs/AlGaAs MQW devices to MOSIS 0.8 /spl mu/m CMOS for 1 Gb/s two-beam smart-pixel receiver/transmitter
A two-beam optical repeater circuit operates to 1 Gb/s, consumes 10 mW, occupies about 1100 /spl mu/m/sup 2/, and is realized with a technology capable of providing thousands of optical inputs and outputs to foundry-grade VLSI silicon CMOS circuitry. The technology provides this capability by attaching GaAs/AlGaAs multiple-quantum-well (MQW) modulators and detectors to VLSI CMOS with flip-chip solder bonding. The main unique features are summarized.