铜层集成电源器件的能量性能

Y.S. Chung, T. Willett, V. Macary, S. Merchant, B. Baird
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引用次数: 16

摘要

器件级解决方案对于智能电源器件的热管理是必要的。对于许多汽车应用,功率脉冲太短,无法影响包装的温度。由于其热性能,厚铜层是一种潜在的解决方案。本文首次报道了将厚铜层集成到智能电源技术中的DMOS功率器件能量性能的实验结果。实验观察到,在功率器件上覆盖一层较厚的铜层可以显著提高功率器件的能量性能。讨论了厚铜层提高能量性能的机理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Energy capability of power devices with Cu layer integration
Device level solutions are necessary for thermal management in smart power devices. For many automotive applications, the power pulses are too short for for packaging to affect the temperature. A thick copper layer is a potential solution because of its thermal properties. This paper reports for the first time experimental results on the energy capability of DMOS power devices with a thick copper layer integrated into a smart power technology. It was experimentally observed that a thick copper layer over the power device enhances energy capability significantly. The mechanics of the thick copper layer in increasing the energy capability is discussed.
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