{"title":"通过扫描链诊断提高产量","authors":"F. Kuo, Yuan-Shih Chen","doi":"10.1109/ATS.2009.70","DOIUrl":null,"url":null,"abstract":"Advances in the semiconductor manufacturing technologies have resulted in the defect distribution to both random defects and process weakness due to smaller geometry. The keep-increasing complexity of the designs makes the traditional failure analysis and yield learning techniques inadequate for finding the root cause.","PeriodicalId":106283,"journal":{"name":"2009 Asian Test Symposium","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Yield Ramp up by Scan Chain Diagnosis\",\"authors\":\"F. Kuo, Yuan-Shih Chen\",\"doi\":\"10.1109/ATS.2009.70\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Advances in the semiconductor manufacturing technologies have resulted in the defect distribution to both random defects and process weakness due to smaller geometry. The keep-increasing complexity of the designs makes the traditional failure analysis and yield learning techniques inadequate for finding the root cause.\",\"PeriodicalId\":106283,\"journal\":{\"name\":\"2009 Asian Test Symposium\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-11-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 Asian Test Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ATS.2009.70\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 Asian Test Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ATS.2009.70","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Advances in the semiconductor manufacturing technologies have resulted in the defect distribution to both random defects and process weakness due to smaller geometry. The keep-increasing complexity of the designs makes the traditional failure analysis and yield learning techniques inadequate for finding the root cause.
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