薄膜有机材料高频特性研究

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967629

S. Dalmia, J. Hobbs, V. Sundaram, M. Swaminathan, G. White, R. Tummala, S. Ogitani

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引用次数: 3

摘要

在低损耗薄膜有机高密度互连(HDI)衬底上，考虑线宽和介电厚度等工艺参数的潜在变化，设计、制作了几种混合共面波导微带(CPWM)良好匹配线，并进行了高达6 GHz的测试。然后用多个CPWM线表征高达6 GHz的薄膜介电介质。

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Characterization of thin film organic materials at high frequency

By considering the potential variation of process parameters such as line width and dielectric thickness, several hybrid coplanar waveguide microstrip (CPWM) well matched lines were designed, fabricated and tested up to 6 GHz on a low loss thin film organic high density interconnect (HDI) substrate. The multiple CPWM lines were then used to characterize the thin film dielectric up to 6 GHz.

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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