声学耦合神经植入物的陶瓷封装

Konlin Shen, M. Maharbiz
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引用次数: 7

摘要

最近,超声波已经成为一种能量模式,用于为非常小的植入式设备供电和通信。在学术文献中,已证实的超声驱动装置已被包装在各种类型的聚合物封装剂中。传统的聚合物绝缘材料,如聚对二甲苯和硅胶,在植入后会开裂、分层或允许水蒸气扩散。陶瓷和金属等材料对生物环境的抵抗力更强,比聚合物的水蒸气渗透性低得多。虽然陶瓷和金属通常用于医疗植入物,但是否有可能实现有效的声能传递和反向散射通信,仍有待证明。在这项工作中,我们提出了一种用于神经应用的超声植入物封装的混合陶瓷-金属封装方法。氧化铝封装用活性钎焊合金连接到铂电极上,并使用激光微焊接来密封封装腔。我们展示了声学窗口可以被设计到植入物中,使超声波反向散射通信成为可能,并开启了长期植入、无线、无引线和无电池的神经接口的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ceramic Packages for Acoustically Coupled Neural Implants
Recently, ultrasound has emerged as an energy modality for powering and communicating with very small implantable devices. In the academic literature, demonstrated ultrasonically-powered devices have been packaged in polymer encapsulants of various types. Traditional polymeric insulation materials such as parylene and silicone are known to crack, delaminate, or allow water vapor diffusion after implantation. Materials such as ceramics and metals, are much more robust to the biological environment and have significantly lower water vapor permeabilities than polymers. Although ceramics and metals are routinely used in medical implants, it remains to be shown whether packages suitable for efficient acoustic energy transfer and backscatter communication are possible. In this work, we present a hybrid ceramic-metal packaging method for the encapsulation of ultrasonic implants intended for neural applications. Alumina packages are joined to platinum electrodes with an active-braze alloy and laser microwelding is used to seal the package cavity. We show acoustic windows can be engineered into the implant, enabling ultrasonic backscatter communication and opening the possibility of chronically implanted, wireless, leadless, and battery-less, neural interfaces.
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