{"title":"0.5 /spl mu/m功率phemt的射频超速实验","authors":"V. Kaper, P. Ersland","doi":"10.1109/GAASRW.1999.874136","DOIUrl":null,"url":null,"abstract":"The effect of large signal drive on long-term device reliability was investigated on M/A-COM 0.5 /spl mu/m power pHEMTs with 600 /spl mu/m gate periphery by stressing devices on-wafer at normal gate and accelerated drain bias conditions with various RF input drives in the high compression regime (RF overdrive condition). Complete DC characterization and input/output power measurements were performed every 5 minutes during the stress.","PeriodicalId":433600,"journal":{"name":"1999 GaAs Reliability Workshop. Proceedings (Cat. No.00TH8459)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"RF overdrive experiments on 0.5 /spl mu/m power pHEMTs\",\"authors\":\"V. Kaper, P. Ersland\",\"doi\":\"10.1109/GAASRW.1999.874136\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The effect of large signal drive on long-term device reliability was investigated on M/A-COM 0.5 /spl mu/m power pHEMTs with 600 /spl mu/m gate periphery by stressing devices on-wafer at normal gate and accelerated drain bias conditions with various RF input drives in the high compression regime (RF overdrive condition). Complete DC characterization and input/output power measurements were performed every 5 minutes during the stress.\",\"PeriodicalId\":433600,\"journal\":{\"name\":\"1999 GaAs Reliability Workshop. Proceedings (Cat. No.00TH8459)\",\"volume\":\"110 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1999 GaAs Reliability Workshop. Proceedings (Cat. No.00TH8459)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GAASRW.1999.874136\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 GaAs Reliability Workshop. Proceedings (Cat. No.00TH8459)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAASRW.1999.874136","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
RF overdrive experiments on 0.5 /spl mu/m power pHEMTs
The effect of large signal drive on long-term device reliability was investigated on M/A-COM 0.5 /spl mu/m power pHEMTs with 600 /spl mu/m gate periphery by stressing devices on-wafer at normal gate and accelerated drain bias conditions with various RF input drives in the high compression regime (RF overdrive condition). Complete DC characterization and input/output power measurements were performed every 5 minutes during the stress.