{"title":"快速周转,低成本的MCM原型","authors":"J. Demmin","doi":"10.1109/MCMC.1994.292536","DOIUrl":null,"url":null,"abstract":"Summary form given, as follows. nCHIP's \"quick-turnaround, low cost MCM prototyping\" program is simplifying the development of new MCM designs by reducing the long cycle times and large non-recurring engineering (NRE) costs that have created a barrier to entry for many potential MCM users. Much of the time and expense for MCMs arises from the custom nature of most current MCM substrates and packages, as well as the design, manufacturing, and test procedures typical of a young industry. Consequently, the focus of this program is standardization. The effort includes: standard MCM packages and substrate sizes, MCM design kits for user generation and analysis of layouts, improved CAM interfaces linking design and manufacturing, standard MCM test flows, bare die procurement, and MCM component model libraries. Three development vehicles demonstrating the progress during the course of the program with real MCM designs are also included. The progress, current status, and future plans for all of these tasks are presented.<<ETX>>","PeriodicalId":292463,"journal":{"name":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Quick-turnaround, low-cost MCM prototyping\",\"authors\":\"J. Demmin\",\"doi\":\"10.1109/MCMC.1994.292536\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form given, as follows. nCHIP's \\\"quick-turnaround, low cost MCM prototyping\\\" program is simplifying the development of new MCM designs by reducing the long cycle times and large non-recurring engineering (NRE) costs that have created a barrier to entry for many potential MCM users. Much of the time and expense for MCMs arises from the custom nature of most current MCM substrates and packages, as well as the design, manufacturing, and test procedures typical of a young industry. Consequently, the focus of this program is standardization. The effort includes: standard MCM packages and substrate sizes, MCM design kits for user generation and analysis of layouts, improved CAM interfaces linking design and manufacturing, standard MCM test flows, bare die procurement, and MCM component model libraries. Three development vehicles demonstrating the progress during the course of the program with real MCM designs are also included. The progress, current status, and future plans for all of these tasks are presented.<<ETX>>\",\"PeriodicalId\":292463,\"journal\":{\"name\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1994.292536\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1994.292536","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Summary form given, as follows. nCHIP's "quick-turnaround, low cost MCM prototyping" program is simplifying the development of new MCM designs by reducing the long cycle times and large non-recurring engineering (NRE) costs that have created a barrier to entry for many potential MCM users. Much of the time and expense for MCMs arises from the custom nature of most current MCM substrates and packages, as well as the design, manufacturing, and test procedures typical of a young industry. Consequently, the focus of this program is standardization. The effort includes: standard MCM packages and substrate sizes, MCM design kits for user generation and analysis of layouts, improved CAM interfaces linking design and manufacturing, standard MCM test flows, bare die procurement, and MCM component model libraries. Three development vehicles demonstrating the progress during the course of the program with real MCM designs are also included. The progress, current status, and future plans for all of these tasks are presented.<>