{"title":"新一代自组装各向异性导电胶粘剂，用于新兴IT行业的电微键合","authors":"Kyung-In Kim, Kyung-hee Lee","doi":"10.15226/sojmse.2020.00164","DOIUrl":null,"url":null,"abstract":"The importance of the IT industry is becoming more and more prominent as it gradually changes to a non-face-to-face society after the COVID-19, and the next-generation smart devices of 5G mobile communication, micro LEDs, and wearable devices are emerging as the leading of the IT industry. Along with the development of these devices, limitations and problems of the Anisotropic Conductive Adhesive Film (ACF) used as a connection material for Film on Film (FOF), Chip on Glass (COG), Chip on Film (COF), and Film on Glass (FOG) are emerging. [1-5]","PeriodicalId":342686,"journal":{"name":"SOJ Materials Science & Engineering","volume":"276 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Next-Generation Self-Assembled Anisotropic Conductive Adhesive Developed Using Solder Powder for Electrical Micro-Bonding in the Emerging IT Industry\",\"authors\":\"Kyung-In Kim, Kyung-hee Lee\",\"doi\":\"10.15226/sojmse.2020.00164\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The importance of the IT industry is becoming more and more prominent as it gradually changes to a non-face-to-face society after the COVID-19, and the next-generation smart devices of 5G mobile communication, micro LEDs, and wearable devices are emerging as the leading of the IT industry. Along with the development of these devices, limitations and problems of the Anisotropic Conductive Adhesive Film (ACF) used as a connection material for Film on Film (FOF), Chip on Glass (COG), Chip on Film (COF), and Film on Glass (FOG) are emerging. [1-5]\",\"PeriodicalId\":342686,\"journal\":{\"name\":\"SOJ Materials Science & Engineering\",\"volume\":\"276 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-11-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"SOJ Materials Science & Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.15226/sojmse.2020.00164\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"SOJ Materials Science & Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.15226/sojmse.2020.00164","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Next-Generation Self-Assembled Anisotropic Conductive Adhesive Developed Using Solder Powder for Electrical Micro-Bonding in the Emerging IT Industry
The importance of the IT industry is becoming more and more prominent as it gradually changes to a non-face-to-face society after the COVID-19, and the next-generation smart devices of 5G mobile communication, micro LEDs, and wearable devices are emerging as the leading of the IT industry. Along with the development of these devices, limitations and problems of the Anisotropic Conductive Adhesive Film (ACF) used as a connection material for Film on Film (FOF), Chip on Glass (COG), Chip on Film (COF), and Film on Glass (FOG) are emerging. [1-5]
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
