低于0.2 /spl mu/m的DRAM埋道pet器件的阈值电压异常

C. Murthy, R. Katsumata, S. Inaba, R. Rengarajan, P. Oldiges, P. Ronsheim
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引用次数: 0

摘要

在低于0.2 /spl mu/m的CMOS技术中,采用测量和仿真方法研究了长沟道埋沟道(BC-) fet器件的阈值电压(V/sub - t/)对栅极氧化物厚度(t/sub - ox/)的依赖性。使用N/sub - 2/注入的双栅氧化工艺的结合产生了更薄的栅极氧化物和良好的RTA,导致更薄的t/sub - ox/器件具有更高的V/sub -t/,与预期相反(V/sub -t/ -t/sub - ox/异常)。对掺杂剖面、耗尽轮廓和电势的详细分析证实了在增强和耗尽操作模式中的这种异常。这些研究表明,在bc - pfts中,表面附近和bc层周围的净掺杂平衡是对Vt控制的严格要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Threshold-voltage anomaly in sub-0.2 /spl mu/m DRAM buried-channel pFET devices
Measurements and simulation have been used to study threshold-voltage (V/sub t/) dependence on gate oxide thickness (t/sub ox/) for long-channel buried-channel (BC-) pFET devices in sub-0.2 /spl mu/m CMOS technologies. The combination of the dual gate oxide process using N/sub 2/ implantation to create the thinner gate oxide and well RTA results in the thinner t/sub ox/ devices having higher V/sub t/, contrary to expectation (V/sub t/-t/sub ox/ anomaly). Detailed analysis of doping profiles, depletion contours, and electric potential confirms this anomaly both in the enhancement and depletion modes of operation. These studies show that a balance of net doping between that near the surface and that around the BC-layer is a stringent requirement for the Vt control in BC-pFETS.
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