WASP示范项目:晶圆级系统的工程设计

I. Jalowiecki, S. Hedge
{"title":"WASP示范项目:晶圆级系统的工程设计","authors":"I. Jalowiecki, S. Hedge","doi":"10.1109/ICWSI.1990.63881","DOIUrl":null,"url":null,"abstract":"The aim of the Brunel University/Aspex Microsystems WASP (WSI Associative String Processor) project is the production of high performance, cost-effective, practical monolithic Wafer-Scale Parallel Processing systems. The Associative String Processor (ASP) architecture is a massively parallel, fine-grain architecture, suitable for VLSI, ULSI and WSI fabrication. Following a considerable period of test chip experimentation, addressing fundamental WSI design issues, this work graduated to a programme of first technology, and then functional demonstrators. Designed to progress towards a practical WASP in a series of carefully planned steps, these devices prove the feasibility of the WASP architecture and provide engineering data and proof of principle unobtainable by any other means. The authors summarise the demonstrator programme to date, including the test results from the first technology demonstrator (WASP 1) and the architecture of the second technology demonstrator (WASP 2).<<ETX>>","PeriodicalId":206140,"journal":{"name":"1990 Proceedings. International Conference on Wafer Scale Integration","volume":"102 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"The WASP demonstrator programme: the engineering of a wafer-scale system\",\"authors\":\"I. Jalowiecki, S. Hedge\",\"doi\":\"10.1109/ICWSI.1990.63881\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The aim of the Brunel University/Aspex Microsystems WASP (WSI Associative String Processor) project is the production of high performance, cost-effective, practical monolithic Wafer-Scale Parallel Processing systems. The Associative String Processor (ASP) architecture is a massively parallel, fine-grain architecture, suitable for VLSI, ULSI and WSI fabrication. Following a considerable period of test chip experimentation, addressing fundamental WSI design issues, this work graduated to a programme of first technology, and then functional demonstrators. Designed to progress towards a practical WASP in a series of carefully planned steps, these devices prove the feasibility of the WASP architecture and provide engineering data and proof of principle unobtainable by any other means. The authors summarise the demonstrator programme to date, including the test results from the first technology demonstrator (WASP 1) and the architecture of the second technology demonstrator (WASP 2).<<ETX>>\",\"PeriodicalId\":206140,\"journal\":{\"name\":\"1990 Proceedings. International Conference on Wafer Scale Integration\",\"volume\":\"102 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-01-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1990 Proceedings. International Conference on Wafer Scale Integration\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICWSI.1990.63881\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1990 Proceedings. International Conference on Wafer Scale Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1990.63881","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13

摘要

布鲁内尔大学/Aspex微系统WASP (WSI关联串处理器)项目的目标是生产高性能,经济高效,实用的单片晶圆级并行处理系统。联想串处理器(ASP)架构是一种大规模并行、细粒度架构,适用于VLSI、ULSI和WSI制造。经过相当长一段时间的测试芯片实验,解决了基本的WSI设计问题,这项工作升级为第一个技术方案,然后是功能演示。这些设备旨在通过一系列精心规划的步骤向实际的WASP迈进,证明了WASP体系结构的可行性,并提供了其他任何方法都无法获得的工程数据和原理证明。作者总结了迄今为止的演示程序,包括第一个技术演示器(WASP 1)的测试结果和第二个技术演示器(WASP 2)的体系结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The WASP demonstrator programme: the engineering of a wafer-scale system
The aim of the Brunel University/Aspex Microsystems WASP (WSI Associative String Processor) project is the production of high performance, cost-effective, practical monolithic Wafer-Scale Parallel Processing systems. The Associative String Processor (ASP) architecture is a massively parallel, fine-grain architecture, suitable for VLSI, ULSI and WSI fabrication. Following a considerable period of test chip experimentation, addressing fundamental WSI design issues, this work graduated to a programme of first technology, and then functional demonstrators. Designed to progress towards a practical WASP in a series of carefully planned steps, these devices prove the feasibility of the WASP architecture and provide engineering data and proof of principle unobtainable by any other means. The authors summarise the demonstrator programme to date, including the test results from the first technology demonstrator (WASP 1) and the architecture of the second technology demonstrator (WASP 2).<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信