{"title":"计算机辅助可靠性评估","authors":"Ji Wu, M. Pecht, Jiaji Wang","doi":"10.1109/EPTC.2003.1298689","DOIUrl":null,"url":null,"abstract":"This paper describes the structure and operation of integrated software tools being developed at the CALCE Electronic Products and Systems Center which facilitate design-for-reliability and virtual qualification of electronic systems at the component and circuit card level.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Computer aided reliability assessment\",\"authors\":\"Ji Wu, M. Pecht, Jiaji Wang\",\"doi\":\"10.1109/EPTC.2003.1298689\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the structure and operation of integrated software tools being developed at the CALCE Electronic Products and Systems Center which facilitate design-for-reliability and virtual qualification of electronic systems at the component and circuit card level.\",\"PeriodicalId\":201404,\"journal\":{\"name\":\"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2003.1298689\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2003.1298689","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper describes the structure and operation of integrated software tools being developed at the CALCE Electronic Products and Systems Center which facilitate design-for-reliability and virtual qualification of electronic systems at the component and circuit card level.